Product Details

2.00mm Wire to Board Wafer Single Row Straight Dip Type 2417SJ-XX

  • Model:2417SJ-XX
SPECIFICATIONS
  Mating part   2418HJ-XX
  Current rating   2.0A AC / DC
  Voltage rating   125V AC / DC
  Contact resistance   20m ohm. max
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    500V AC for one minute
  Operating temperature    -40°C ~ +85°C
  Material plating  
1. Insulator: Nylon 66(UL94V-0)
2. Contact: Phospher Bronze
3. Plating: Tin Plated
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