Product Details

2.50mm Wire to Board Wafer Single Row R/A Dip Type 2317REH-XX

  • Model：2317REH-XX
SPECIFICATIONS
  Mating part    2318HEH-XX
  Current rating   3.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   10m ohm. max
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,000V AC for one minute
  Operating temperature    -40°C ~ +105°C
  Material plating   See datasheet
    Inquiry Datasheet
     

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