2.00mm Wire to Board Wafer Single Row R/A Dip Type 2417RJ-XXX

  Mating part   2418HJ-XX
  Current rating   2.0A AC / DC
  Voltage rating   100V AC / DC
  Contact resistance   20m ohm. max
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    800V AC for one minute
  Operating temperature    -25°C ~ +85°C
  Material plating   See datasheet