Product Details

3.00mm Wire to Board Wafer Double Rows Straight Dip Type 5561S-XX-XX

  • Model:5561S-XX-XX
SPECIFICATIONS
  Mating part   5560-XX
  Current rating   5.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   10m ohm. max.
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,500V AC for one minute
  Operating temperature    -25°C ~ +105°C
  Material plating  
1. Insulator: High Temperature Plastic (UL94V-0)
2. Contact: Copper Aolly
3. Plating: Tin Plated
    Inquiry Datasheet
    Features
    Prevents accidental mismating
    Ensures a reliable connection 
    High-temperature LCP headers
    SMT or through hole mount compatible versions available
    Fully isolated terminals


    Application
    Consumer
    Washers and Dryers
    Refrigerators and Freezers
    Printers and Scanners
    Security Systems
    Vending Machines
    Automotive
    Inside Devices
    Medical
    Healthcare IT 
    Patient Monitoring
    Telecommunications / Networking
    Routers and Switches
    Servers
    Sustainable Energy
    Solar Power



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